Focus every possibility
Focus every possibility
HGLASER-> Production -> LED wafer wafer laser scribing machine -> LED wafer wafer laser scribing machine
This kind of cutting system is adapted to cut extension patch of LED sapphire underlay. Products have advantage of high precison of location¡¢small focus facula¡¢adopting CCD coaxial stakeout,which can satisfy cutting technical requirment of patch of LED sapphire underlay.
| 1.Highlights |  |
High precision linear moving platform
Marble foundation bed bear the weight of working table
Focus tunable framework
Include CCD location system
CCD coaxial stakeout
High reliablity,easy operation
low maintenance cost and running cost
| 2Applications | |
dapted to extension patch of LED sapphire underlay.
| 3. Technical Parameters |  |
|
Laser wavelength |
355nm |
|
Laser power |
1.5W@100KHz |
|
Accuracy of X.Y axeses |
0.5um |
|
Accuracy of Z axes |
0.5um |
|
Accuracy of ¦È axes |
0.0005Degree |
|
CCD location accuracy |
1um |
|
Location accuracy |
1um |
|
Reptition location accuracy |
0.5um |
|
Effective route of working table |
150mm x 150mm |
|
Max cutting dimension |
3inch |
|
Cutting line width |
6-8um |
|
Cutting depth |
20∼30um |
|
Cutting speed |
25∼55mm/s |
