LDU6 UV Wafer Laser Cutting System researched by HGLaser is with internationl advanced lever.It is adopted with UV cold laser source, with small heat affected zone and fine scribing quality. Non-contact processing which avoids stress generates during processing can increase the cutting quality and efficiency of the crystalline grain.After processing, the chip will have good electrical performance. This system which is integrated with manual cutting system and CCD graph processing system can acheive manual cutting or auto cutting.

1.Highlights

Advanced hardware control technology and intelligent software
    High laser beam quality, small focus, long service lifetime of laser
    Auto graph identifing and positioning function
    High precision 2 dimension moving working table, high accuracy rotary working table
    High reliabity, high stability and high security
    After cutting, the crystalline grain with high quality and high yield
    Key panel controlling,easy operation.

Advanced hardware control technology and intelligent software 

High laser beam quality, small focus, long service lifetime of laser

High precision 2 dimension moving working table

high accuracy rotary working table

Auto graph identifing and positioning function

Key panel controlling,easy operation 

2Applications

This system is applied in cutting semiconductor wafer product,such as single, double mesa glass passivation diode wafer, single&double mesa SCR wafer and IC wafer etc.

3. Technical Parameters