HGL-LDF20 Laser Scribing Machine is adopted 20W fiber laser with optics isolation system. It has high stability and good optical quality, which is advanced than traditional lamp-pumped laser. Its 10.64nm laser wavelength could scribe on silicon battery, which with significant advantages compare with traditional lamp pumped laser source.

1.Highlights

Good laser beam quality
Low running cost
Free maintenance
Compact dimension
Easy operation and strong function professional scribing software

2.Characteristics

The edge of scribing line is smooth, could avoid small cracks by knife
cutting and upgrade production quality.
High working efficiency, the scribing speed is 1.5-2 times faster than lamp
pumped laser.
Because laser is utilized instantaneous high temperature to work on material
surface, its hot influencing area is small and there is no impurity to remain,
with high optical transmitting efficiency.
Non-contact process method, it has no pollution for environment

3.Applications

To scribe or cutting the cell or wafer of Monocrystalline Silicon, Silicon Polycrystal Silicon, amorphous silicon in solar industry; To scribe the thin-film amorphous silicon battery.; Substrate The rowing slice and cutting of semiconductor substrate materials such as electron trade silicon, germanium, the GaAs,etc..

4. Technical Parameters