Invitation Letter of CHTF2013
China Hi-tech Fair, as the No.1 Technology Show in China, will be held at Shenzhen Convention & Exhibition center on November 16-21, 2013. The theme of CHTF 2013 is “Promoting the Scientific and Technological Innovation, Upgrading the Development Quality.”
As the pioneer and leader of China’s laser technology industrial application, HGLaser is invited to attend CHTF 2013 to introduce a variety of new products, showing the spirit of “Representing National Competitiveness and Possessing International Competitiveness”. The main equipment on show are: 3D laser marking machine, UV laser marking machine, LCC200II CO2laser cutting machine and PF150 high-speed divided galvo head welding system.
Welcome to our booth: 1C26.
Opening Ceremony: November 16
Exhibition & Trade: November 16-21
Forum & super-SUPER activity: November 16-19
Venue: Shenzhen Convention & Exhibition center
3D Laser Marking Machine
HGLaser self-development 3D dynamic laser marking machine can mark on any three-dimensional surface through hardware and software control, and customized 3D vibrating mirror configuration. It applies to mobile phone manufacturing, three-dimensional circuit, medical equipment, 3C electronics, auto parts, and electronic communications industry.
UV Laser Marking Machine
HGLaser UV laser marking machine is based on our self-development 355nm UV laser. UV laser marking machine has incomparable advantage in precision marking, precision cutting, micro processing of special material, because of tiny facula and almost no heat affected zone. It is mainly applied to all kinds of glass, LCD screens, textiles, thin ceramic, semiconductor wafers, IC crystal, sapphire, polymer films and other materials and surface marking treatment.
PF150 High-Speed Divided Galvo Head Welding System
HGLaser PF150 high-speed divided galvo head welding system is more flexible compared to other welding machine. It is mainly applied to optical fiber coupler parts, fiber optic connection devices, tube gun metal parts, mobile phone vibration motor, clock precision parts, precision welding of auto lamp, etc.
LCC200II CO2 Laser Cutting Machine
HGLaser LCC200II is a new type of high-performance CO2 laser processing equipment with characteristics of high-speed, low cost, easy operation, etc. It is mainly applied to ceramic cutting, drilling and other kinds of non-metallic materials processing.