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Infrared Wafer Laser Scribing Machine

This machine LDC-5142 has international competitive edge. It adopts 1064nm infrared laser as cutting tool, which has superior cutting quality. This machine owns advantages of fast speed, easier operation, low maintenance costs, etc. It is suitable for single-table glass inactive diode wafer cutting & scribing in diode manufacture industry.

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+86 27 8718 0225

E-mail:info@hglaser.com

Fax:+86-27-87180210

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This machine LDC-5142 has international competitive edge. It adopts 1064nm infrared laser as cutting tool, which has superior cutting quality. This machine owns advantages of fast speed, easier operation, low maintenance costs, etc. It is suitable for single-table glass inactive diode wafer cutting & scribing in diode manufacture industry.

● Fast speed, reach 150mm/s for single-table glass inactive diode wafer cutting. 15-20 times than tangent speed of traditional blade scribing machine, and 3-5 times than its dorsal speed;
● High processing quality, good beam quality, suitable for precision scribing, no mechanical stress, minimize the collapse and microcrack of chips;
● Low operating costs, average trouble-free operation up to 100, 000 hours, high electro-optic conversion efficiency, equipment power below 2KW, save energy consumption for long use;
● Powerful software with proprietary intellectual property rights, easy operation.

HGLASER LHR300D infrared laser diode wafer dicing machine is mainly used in single-table glass inactive diode wafer cutting & scribing in semiconductor manufacturing industry.

Laser Wavelength

1064nm●

Laser Power

20W

Positioning Accuracy

±4μm

XY Grating Ruler Resolution

0.1μm

Z Axis Accuracy

±1μm

Rotation Axis Accuracy

±20″

CCD Positioning Accuracy

1-2μm

Repeat Positioning Accuracy

±1μm

Working Table Route

250mm×250mm

Max Cutting Size

4 inches

Cutting Width

30-50μm

Cutting Depth

80-120μm

Cutting Speed

1-150mm/s

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