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Full Automatic Non-backside Scratch Laser Scribing Machine

New generation of full automatic non-backside scratch laser scribing machine was launched with 6-month efforts to build a wafer cutting product line. This specialist equipment has been recognized by markets and customers. It realizes unmanned cutting operation, while increasing cutting speed by 20% and positioning precision to 0.004 mm. 

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With high automation level, HGLASER’s full automatic non-backside scratch laser scribing machine realizes unmanned cutting operation, while increasing cutting speed by 20% and positioning precision to 0.004 mm. 

Glass-passivated diode is a kind of diode chipped and passivated by glass beads, to protect the circuit chip. It has relatively high requirements for cutting and package. And the so called GPP is actually the name of package.

Automatic laser wafer scribing machine VS Standard laser cutting machine

Items Standard laser 
cutting Machine
Automatic laser  
wafer scribing machine 
PS
Automatic loading & unloading × It will save time by 50% after upgrading
automatic identification × The identification range will be 15*15mm
Non-backside scratch laser machine × It can do without feature points on N side,with N side for cutting and P side for imaging. 
Pause function during alignment × It may enhance cutting precision by avoiding cutting 
with different sizes.


1. Full-automatic loading and unloading: non-contact chuck guaranteed wafer of no damage.

Automatic loading and unloading system can improve not only production line mechanization process consistency by reducing labor costs, but also the cutting efficiency. It may realize operation of 10 devices instead of only 2 or 3 by one operator.

2、Non-backside scratch laser automatic alignment

Non-backside scratch laser automatic alignment spares customers of providing back-mark chips, for each piece of this chips "+" costs 0.5-1 RMB, improving the processing time and yielding rate significantly. The automatic alignment function, superior to manual alignment, may raise cutting efficiency and consistency of chips while decreasing the risk of manual misoperation. There is no need of manually position mechanization, improving efficiency, consistency chip, and avoiding human errors.

3、Pause function during high speed alignment cutting  

You can set the stops at any position without worries for CCD quick shooting re-alignment to safeguard the whole process. And the cutting accuracy will be controlled within 8 microns. It may greatly improve cutting efficiency by 20%.High-speed alignment features that solve customer process accuracy problems, are free to set the cutting line pause, real-time cutting position adjustment, to avoid customer linear positive, negative deviation from the yield loss caused.

Items

Parameters

Power Requirment

220V, 50~60Hz

Positioning Accuracy

0.006mm

Repeated Positioning Accuracy

0.004mm 

Scribing speed

0~150mm/s 

Rotating Accuracy

0.001degree

Scribing line width

0.030~0.045mm 

Laser source

fiber , UV