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UV Laser Wafer Dicing Machine

This machine is independent researched and developed by HGLASER, which has advanced international level. Adopting with high-quality UV as cutting source, the cutting quality and cutting efficiency of chip are much better than traditional blade cutting equipments. The automatic registration and adjusting device can raise the automaticity and provide more convenient operation. The UV laser cold light source has small thermal affected zone and superior cutting quality. Non-contact process can avoid stress in processing, improve the cutting quality and efficiency of grain. With the manual cutting and CCD image processing system, it implements manual cutting or automatic cutting.


Customer Service Hotline
+86 27 8718 0225

E-mail:info@hglaser.com

Fax:+86-27-87180210

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The self-developed laser wafer dicing machine of HGLASER has advanced international level. Adopting with high-quality UV as cutting source, the cutting quality and cutting efficiency of chip are much better than traditional blade cutting equipments. The automatic registration and adjusting device can raise the automaticity and provide more convenient operation. The UV laser cold light source has small thermal affected zone and superior cutting quality. Non-contact process can avoid stress in processing, improve the cutting quality and efficiency of grain. With the manual cutting and CCD image processing system, it implements manual cutting or automatic cutting.

● Good beam quality, small focus, superior grain quality and high yield;
● High reliability, high stability, high safety, long service life;
● High-precision two-dimensional motion platform and high-precision rotating platform, digital control panel, easy operation;
● Advanced hardware control technology and intelligent software, automatic image identification and positioning.

It is used in single-table and double-table glass inactive diode wafer, single-table and double-table SCR wafer and IC wafer cutting & scribing in semiconductor manufacturing industry.

Laser Wavelength

355nm

Laser Power

5W

Positioning Accuracy

±4μm

XY Grating Ruler Resolution

0.1μm

Z Axis Accuracy

±1μm

Rotation Axis Accuracy

±20″

CCD Positioning Accuracy

1-2μm

Repeat Positioning Accuracy

±1μm

Working Table Route

250mm×250mm

Max Cutting Size

4 inches

Cutting Width

20-30μm

Cutting Depth

50-80μm

Cutting Speed

60mm/s

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