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QCW Fiber Laser Cutting Machine

QCW fiber laser cutting machine LCF150QCI use fiber laser to achieve rapid precision cutting and drilling for sapphire, ceramics, silicon, metal and other materials, with a wide range of applications.

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QCW fiber laser cutting machine LCF150QCI use fiber laser to achieve rapid precision cutting and drilling for sapphire, ceramics, silicon, metal and other materials, with a wide range of applications.

1. Using imported fiber lasers, good beam quality, high power stability;
2. Using import cutting head, good focusing spot quality, good cutting effect;
3. Equipment collocates with optical marble platform, high-speed high-precision linear motor and negative pressure adsorption system, accuracy positioning, high processing stability.

QCW Fiber Laser Cutting Machine LCF150QCI  is suitable for sapphire phone panels and lens cover, ceramic panels and other components, silicon and other materials cutting.

Product model LCF150QCI
Laser parameters Laser Imported fiber lasers
Average output power 150W, peak power: 150W
8 hours power stability <3.0%
Device parameters Effective working area 400mm×400mm (customizable)
Motion Platform High speed & high precision linear motor
Z axis lift range 100mm
Optional accessories CCD vision positioning system
Technology parameters Edge chipping size <30μm (Depending on material)
Dimensional accuracy ±20μm
Taper <2°
Cutting thickness ≤2mm ( depending on appropriate laser)
Cutting efficiency 5-20mm/s (Depending on material)
Applicable materials Sapphire, ceramic, silicon
Others Environmental requirements Temperature: 18-27 ° C Relative humidity: 10% -80% (no condensation)
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