QCW Fiber Laser Cutting Machine
QCW fiber laser cutting machine LCF150QCI use fiber laser to achieve rapid precision cutting and drilling for sapphire, ceramics, silicon, metal and other materials, with a wide range of applications.
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QCW fiber laser cutting machine LCF150QCI use fiber laser to achieve rapid precision cutting and drilling for sapphire, ceramics, silicon, metal and other materials, with a wide range of applications.1. Using imported fiber lasers, good beam quality, high power stability;
2. Using import cutting head, good focusing spot quality, good cutting effect;
3. Equipment collocates with optical marble platform, high-speed high-precision linear motor and negative pressure adsorption system, accuracy positioning, high processing stability.
QCW Fiber Laser Cutting Machine LCF150QCI is suitable for sapphire phone panels and lens cover, ceramic panels and other components, silicon and other materials cutting.
|Laser parameters||Laser||Imported fiber lasers|
|Average output power||150W, peak power: 150W|
|8 hours power stability||＜3.0%|
|Device parameters||Effective working area||400mm×400mm (customizable)|
|Motion Platform||High speed & high precision linear motor|
|Z axis lift range||100mm|
|Optional accessories||CCD vision positioning system|
|Technology parameters||Edge chipping size||＜30μm (Depending on material)|
|Cutting thickness||≤2mm ( depending on appropriate laser)|
|Cutting efficiency||5-20mm/s (Depending on material)|
|Applicable materials||Sapphire, ceramic, silicon|
|Others||Environmental requirements||Temperature: 18-27 ° C Relative humidity: 10% -80% (no condensation)|