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QCW Fiber Laser Cutting Machine

QCW fiber laser cutting machine LCF150QCI use fiber laser to achieve rapid precision cutting and drilling for sapphire, ceramics, silicon, metal and other materials, with a wide range of applications.

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QCW fiber laser cutting machine LCF150QCI use fiber laser to achieve rapid precision cutting and drilling for sapphire, ceramics, silicon, metal and other materials, with a wide range of applications.

1. Using imported fiber lasers, good beam quality, high power stability;
2. Using import cutting head, good focusing spot quality, good cutting effect;
3. Equipment collocates with optical marble platform, high-speed high-precision linear motor and negative pressure adsorption system, accuracy positioning, high processing stability.

QCW Fiber Laser Cutting Machine LCF150QCI  is suitable for sapphire phone panels and lens cover, ceramic panels and other components, silicon and other materials cutting.

Product modelLCF150QCI
Laser parametersLaserImported fiber lasers
Average output power150W, peak power: 150W
8 hours power stability<3.0%
Device parametersEffective working area400mm×400mm (customizable)
Motion PlatformHigh speed & high precision linear motor
Z axis lift range100mm
Optional accessoriesCCD vision positioning system
Technology parametersEdge chipping size<30μm (Depending on material)
Dimensional accuracy±20μm
Taper<2°
Cutting thickness≤2mm ( depending on appropriate laser)
Cutting efficiency5-20mm/s (Depending on material)
Applicable materialsSapphire, ceramic, silicon
OthersEnvironmental requirementsTemperature: 18-27 ° C Relative humidity: 10% -80% (no condensation)
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