HGLASER

The LED UV laser dicing machine of HGLASER adopts superior UV laser source and high-precision worktable. The unique optical path design is convenient for positioning. The CCD image processing system meets the demands of fast speed and high quality of epitaxial wafer. It has the features of high positioning precision, small focusing spot and CCD coaxial monitoring cutting, which meet the requirements of cutting crafts for LED sapphires substrate epitaxial wafers. So it is mainly used in cutting LED sapphires substrate epitaxial wafers.


● High-precision linear motion tables, marble pedestal, adjustable focus;
● CCD coaxial monitoring, image automatic identification and automatic positioning cutting;
● Good beam quality, no mechanical stress, minimizing the collapse and microcrack of chips;
● Low operating costs, average trouble-free operation up to 100, 000 hours, high electro-optic conversion efficiency, saving energy consumption for long use;
● Easy operation, powerful software with proprietary intellectual property rights.

It is mainly used in cutting LED sapphires substrate epitaxial wafer.