Wafer Industry

Series Introduction
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Series Introduction

The laser wafer dicing machine, developed by HGLASER, has international advanced level, high quality laser cutting source, small heat affected zone and non-contact processing, which can improve the cutting quality and efficiency of crystal grains. The processed chips have excellent electrical properties.

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Application Area

Wafer industry, semiconductor manufacturing, single-table or double-table glass inactive diode wafer, single-table or double-table controlled silicon wafer, IC wafer cutting, etc.

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1. HGLASER is responsible for installing equipments, debugging and training technical personnel for customers;
2. The service network of HGLASER throughout the country, any problems of customers would get response within 8 hours, and be solved within 24 hours;
3. HGLASER provides one year warranty and lifetime maintenance. HGLASER provides first-class products, first-class quality and first-class service to customers.